Wafer.space lets you design your custom silicon just for $7/die(Crowdfunding)

wafer.space has launched its first pooled silicon fabrication run on Crowd Supply, called the GF180MCU Run 1, which enables designers, engineers, and companies to create 1,000 custom ASICs using GlobalFoundries’ 180 nm mixed-signal process. 

Each slot provides a fixed 3.88 × 5.07 mm (19.67 mm²) die area replicated 1,000 times, meaning you will receive 1000 chips, with options for bare dies or chip-on-board packaging. The GF180MCU process supports 5 metal layers, MIM capacitors (~2.0 fF/µm²), poly and high-res poly resistors, and standard-Vt MOS devices. Users can handle their own pad ring, ESD, and I/O layout while wafer.space manages fabrication, dicing, and shipping from Singapore. Designs can be open or closed source, and full wafers are also available for advanced testing or collection.

wafer.space chip on board (COB) assembly

Designs are submitted to wafer.space as GDSII files (the standard file format for chip layouts). Wafer.space automatically checks these files to make sure they can be manufactured correctly. You can design your chip using either open-source tools like LibreLane, Magic, KLayout, xschem, and SPICE, or commercial EDA software.

Wafer.space also offers an optional packaging service where the chips can be mounted and connected directly on a circuit board using ready-made templates. The company is also working with JLCPCB, PCBWay, and Seeed Studio to enable direct PCBA assembly and bonding for future runs. For advanced research use, full undiced wafers are available for MEMS, sensor, and nanofluidics applications. Wafer.space offers guides and Discord forums to help users with pad-ring design, verification, and final design checks.

wafer.space GF180MCU Run 1 wafers

wafer.space completed silicon wafer with multiple dies

Each slot in the GF180MCU Run 1 costs $7,000 for 1,000 bare dies or $8,500 with chip-on-board wire bonding and packaging, as mentioned in the campaign. Wafer.space offers guides and community forums to help users with pad-ring design, verification, and final design checks.

The Crowd Supply campaign for GF180MCU Run 1 closes on November 28, 2025, with a design submission deadline of December 3, 2025. Fabrication and packaging are handled by GlobalFoundries in Singapore, with shipments expected in March 2026. More information is available on the wafer.space website. You can also check the E-Lab Interview with Wafer.Space Founder for more information.

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